Features |
|
3.5” form factor embedded board with AMD Geode™ LX 800 processor and RoHS compliant
|
|
DDR 333/400MHz SO-DIMM SDRAM up to 1GB
|
|
Complete I/O support with IDE, CF Type II, single LAN and three external USB 2.0
|
|
18-bit single-channel LVDS
|
 |
Value embedded applications with low power and fanless design. Support Windows® XP/CE/XPe
|
 |
The best choice for thin client Windows® CE 5.0, XPe OS image with ICA, RDP and IE APs ready |
 |
One Key Recovery solution allows you to create rapid OS backup and recovery |
CPU |
On board AMD Geode™ LX800 (500MHz) processor |
System Chipset |
AMD Geode LX800 + AMD CS5536 |
BIOS |
Award BIOS |
System Memory |
One 200-pin 400/333MHz DDR SDRAM SO-DIMM Supported (system max. 1GB) |
Ethernet |
Single 10/100Mbps RTL8100C Ethernet Chipset |
I/O Interface |
3 x USB 2.0 (on rear)
1 x LPT
1 x CF Type II
1 x RS-232 (by pin header)
1 x RS-232 (by pin header,TTL Level without transmitter only for Tx/Rx signals)
1 x 6-pin wafer for PS/2 KB/MS
1 x IDE
|
Digital I/O |
8-bit digital I/O, 4-bit input/4-bit output |
Super I/O |
Winbond W83627EHG |
Display Interfaces |
VGA integrated in AMD Geode™ LX 800
18-bit single-channel LVDS |
Watchdog Timer |
Software programmable supports 1~255 sec. system reset |
Power Supply |
5V only, AT/ATX power support |
Power Consumption |
5V@1.53A (AMD LX800 with DDR 400MHz/1GB) |
Temperature |
Operation: 0°C ~ 60°C |
Humidity |
Operation: 5% ~95%, non-condensing |
Dimensions |
146 mm x 102 mm |
Weight |
GW: 670 g/NW: 230 g |
WAFER-LX-800-EN-R10 |
Entry level and cost-effectiveness via 3.5" SBC with AMD Geode™ LX 800 processor, VGA/LVDS, LAN, COM, USB 2.0 |