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HYPER
Full size PIAGP Bus
Full size PICMG 1.3
Full size PICMG 1.0
Half size PICMG 1.3
Half size PISA Bus
Half size ISA Bus
Half size PCI Bus
       

CI7SMP
Socket 370 815E MicroPCI Full-Size SBC with Dual LAN


Features Specifications Ordering Info Datasheet User's Manual

Features
Supports Intel® 815E Chipset
Socket 370, Intel® Pentium® III 500MHz~1GHz CPU Speed
3 DIMMs for up to 512MB SDRAM
MicroPCI Socket for IDE RAID, SCSI, LAN card etc.
Dual Ethernet LAN, Intel® 82559 and ICH2 chips
Hardware Monitoring
DiskOnChip™
Watchdog Timer
Specifications
General Functions
Processor Socket Socket 370
Processor Intel® Pentium® III 500MHz~1GHz
Chipset Intel® 815E AGPset
BIOS Y2K compliant Award BIOS DMI, Plug and Play
Bus Speed 66MHz / 100MHz / 133MHz
Power Management ACPI
L2 Cache CPU Integrated
System Memory Three 168-pin DIMM sockets, Max. 512MB SDRAM
Multi-I/O Winbond W83627HF
COM1:RS-232 with 16 byte FIFO
COM2:RS-232 or RS-422/485 (jumper selectable)
Parallel Port 1xhigh speed Bi-directional SPP/ECP/EPP
IDE Interface 2 channels ATA-33/66/100MHz From ICH2
FDD Interface 2x360K/720K/1.2MB/1.44MB/2.88MB FDDs
Hardware Winbond W83627HF
Monitoring Monitoring CPU/system temperature, voltages and fan speeds
System Monitor utility bundled
Optional Intel® LDCM software
VGA Intel® 815E chipset support CRT display
SI 154 support DVI header
LAN Dual LAN, Intel® 82559 10/100Mbps Ethernet Controller + ICH2
USB Pin header for two USB ports
IrDA Pin header
SSD Interface One DOC socket supporting size up to 288MB M-Systems flash disks
ATX Power Connector 6-pin header pin out
Keyboard PS/2 type connector
Mouse PS/2 type connector
Environmental and Mechanical
Form Factor Full-Size PICMG
8-layer PCB
Dimensions 33.8cm x 12.2cm (13.3" x 4.8")
Operating Temperature 0XC~60XC
Humidity 5%~95%
Storage Temp. -25XC~+65XC
Ordering Info
CI7SMP
Socket 370 815E Full-Size SBC with optional MicroPCI
IDE RAID/LAN/SCSI/ Cards
   

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